Ericsson V.32 Manual de usuario descargar pdf (Pagina 15)

Ericsson Internal

PROD. SPECIFICATION MECHANICAL 1 (4)

Prepared (also subject responsible if other) No.

MICKAOV 5/1301-BMR 603 1203 Uen

Approved Checked Date Rev Reference

EAB/FJB/GKF (Natalie J) See §1

2008-06-05 B

Soldering Information

The product is intended for convection reflow or vapor phase

reflow in Pb-free reflow processes.

The reflow profile should be optimised to avoid excessive

heating of the product. It is recommended to have a

sufficiently extended preheat time to ensure an even

temperature across the host PCB and to minimize the time in

reflow.

A no-clean flux is recommended to avoid entrapment of

cleaning fluids in cavities inside the product or between the

product and the host board, since cleaning residues may

affect long time reliability and isolation voltage.

Reflow process specifications

SnPb eutectic Pb-free

Average ramp-up rate N/A 3°C/s max

Typical solder melting (liquidus)

temperature

N/A +221°C

Minimum reflow time above T

N/A 30 s

Minimum pin temperature T

N/A +235°C

Peak product temperature T

PRODUCT

N/A +260°C

Average ramp-down rate N/A 6°C/s max

Maximum time 25°C to peak N/A 8 minutes

Note: for mixed SnPb / Pb-free soldering, special recommendations apply

PRODU CT

maximum

minimu

Time

profi le

Pr od uc t

prof ile

Time in

reflow

Time in preheat

/ s o a k z o n e

Ti me 25°C to p eak

Temperatur e

General reflow profile (min pin and max product temperature)

Mixed Solder Process Recommendations

When using products with Pb-free solder bumps with SnPb

paste on the host board, and thereby mixing SnPb with Pb-

free solder, and reflowing at SnPb process temperatures

(backwards compatibility), special recommendations apply:

An extended preheat time between +170°C and +180°C for

60 to 90s and a pin reflow temperature (T

) between +220°C

and +225°C for 30 to 60 s is recommended. Ramp-up, ramp-

down and time limitations should be according to Pb-free

reflow process specifications.

The extended preheat time and soak at reflow temperature

will minimize temperature

radients and maximize the wettin

and solder mixing in the final solder joints. The use of nitro

reflow atmosphere will further improve the solder joint quality.

30-60 s

221°C to 225°C

60-90 s

170°C to 180°C

Solder bump

Profile

Temperature

Time

Reflow profile for mixed soldering (pin temperature = solder joint temperature)

Thermocoupler Attachment

Pin Temperature Recommendations

Pin number 6/7 and 18/19 are chosen as reference locations

for the minimum pin temperature recommendations since

these will likely be the coolest solder joints during reflow

Pb-free Solder Processes

For Pb-free solder processes, a pin temperature (T

) in

excess of the solder melting temperature (T

, +217 to +221 °C

for SnAgCu solder alloys) for more than 30 seconds, and a

peak temperature of +235°C on all solder joints is

recommended to ensure a reliable solder joint.

Maximum Product Temperature Requirements

Top of the product PCB near pin 1 is chosen as reference

location for the maximum (peak) allowed product temperature

PRODUCT

), since this will likely be the warmest part of the

product during the reflow process.

Pb-free Solder Processes

For Pb-free solder processes, the product is qualified for

MSL 3 according to IPC/JEDEC standard J-STD-020C.

During reflow, T

PRODUCT

must not exceed +260 °C at any time.

12 13

Top of PCB at pin 1

for measurement of

maximum product

temperature, T

PRODUCT

Pin 6/7 or pin 18/19 for

measurement of

minimum pin (solder

oint) temperature,

(attach sensors as

close as possible to

actual solder joint)

Component outline

BMR 603 1203/1

DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W

EN/LZT 146 393 R1E September 2008

Technical Speciﬁcation

1 2 ... 10 11 12 13 14 15 16 17

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